LPC2134FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC
16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 or HVQFN64 package.
8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip flash program memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader software. Single flash sector or full chip erase in 400 ms and programming of 256 B in 1 ms.
Monday, November 19, 2012
LPC2132FHN64 ARM decryption
LPC2132FHN64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Enhancements brought by LPC213x/01 devices
Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original LPC213x. They also allow for a port pin to be read at any time regardless of its function.
Dedicated result registers for ADC(s) reduce interrupt overhead.
UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware.
Additional BOD control enables further reduction of power consumption.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Enhancements brought by LPC213x/01 devices
Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original LPC213x. They also allow for a port pin to be read at any time regardless of its function.
Dedicated result registers for ADC(s) reduce interrupt overhead.
UART0/1 include fractional baud rate generator, auto-bauding capabilities and handshake flow-control fully implemented in hardware.
Additional BOD control enables further reduction of power consumption.
LPC2132FBD64 ARM decryption
LPC2132FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.
LPC2131FBD64 ARM decryption
LPC2131FBD64 ARM decryption, NXP ARM code extraction, NXP chip decryption, NXP chip crack.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC.
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
LPC2124FBD64 arm crack
LPC2124FBD64 arm crack，ARM decryption，arm code extraction.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC.
With their compact 64-pin package, low power consumption, various 32-bit timers, 4-channel 10-bit ADC, PWM channels and 46 fast GPIO lines with up to nine external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. With a wide range of serial communications interfaces, they are also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC.
With their compact 64-pin package, low power consumption, various 32-bit timers, 4-channel 10-bit ADC, PWM channels and 46 fast GPIO lines with up to nine external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. With a wide range of serial communications interfaces, they are also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.
LPC2114FBD64 arm crack
LPC2114FBD64 arm crack，ARM decryption，arm code extraction.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC。
The LPC2114/2124 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128/256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC。
The LPC2114/2124 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128/256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty.
LPC2106FHN48 mcu crack
LPC2106FHN48 mcu crack，NXP ARM decryption, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM.
16/32-bit ARM7TDMI-S processor.
16/32/64 kB on-chip static RAM.
128 kB on-chip flash program memory. 128-bit-wide interface/accelerator enables high speed 60 MHz operation.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or full chip erase takes 400 ms.
Vectored Interrupt Controller with configurable priorities and vector addresses.
EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute whilst the foreground task is debugged with the on-chip RealMonitor software.
Embedded Trace Macrocell enables non-intrusive high speed real-time tracing of instruction execution.
Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s), and SPI.
Two 32-bit timers (7 capture/compare channels), PWM unit (6 outputs), Real Time Clock and Watchdog.
Up to thirty-two 5 V tolerant general purpose I/O pins in a tiny LQFP48 (7 mm x 7 mm) package.
60 MHz maximum CPU clock available from programmable on-chip Phase-Locked Loop with settling time of 100 us.
The on-chip crystal oscillator should have an operating range of 1 MHz to 25 MHz.
Two low power modes, Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V +- 8.3 pct).
I/O power supply range of 3.0 V to 3.6 V (3.3 V +- 10 pct) with 5 V tolerant I/O pads.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM.
16/32-bit ARM7TDMI-S processor.
16/32/64 kB on-chip static RAM.
128 kB on-chip flash program memory. 128-bit-wide interface/accelerator enables high speed 60 MHz operation.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software. Flash programming takes 1 ms per 512 B line. Single sector or full chip erase takes 400 ms.
Vectored Interrupt Controller with configurable priorities and vector addresses.
EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute whilst the foreground task is debugged with the on-chip RealMonitor software.
Embedded Trace Macrocell enables non-intrusive high speed real-time tracing of instruction execution.
Multiple serial interfaces including two UARTs (16C550), Fast I2C-bus (400 kbit/s), and SPI.
Two 32-bit timers (7 capture/compare channels), PWM unit (6 outputs), Real Time Clock and Watchdog.
Up to thirty-two 5 V tolerant general purpose I/O pins in a tiny LQFP48 (7 mm x 7 mm) package.
60 MHz maximum CPU clock available from programmable on-chip Phase-Locked Loop with settling time of 100 us.
The on-chip crystal oscillator should have an operating range of 1 MHz to 25 MHz.
Two low power modes, Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V +- 8.3 pct).
I/O power supply range of 3.0 V to 3.6 V (3.3 V +- 10 pct) with 5 V tolerant I/O pads.
LPC2106FBD48 mcu crack
LPC2106FBD48 mcu crack，NXP ARM decryption, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
New features implemented in LPC2104/2105/2106/01 devices
Fast GPIO port enables port pin toggling up to 3.5 times faster than the original device and also allows for a port pin to be read at any time regardless of its function.
UART 0/1 include fractional baud rate generator, autobauding capabilities, and handshake flow-control fully implemented in hardware.
Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.
SPI programmable data length and master mode enhancement.
Diversified Code Read Protection (CRP) enables different security levels to be implemented.
General purpose timers can operate as external event counters.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
New features implemented in LPC2104/2105/2106/01 devices
Fast GPIO port enables port pin toggling up to 3.5 times faster than the original device and also allows for a port pin to be read at any time regardless of its function.
UART 0/1 include fractional baud rate generator, autobauding capabilities, and handshake flow-control fully implemented in hardware.
Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.
SPI programmable data length and master mode enhancement.
Diversified Code Read Protection (CRP) enables different security levels to be implemented.
General purpose timers can operate as external event counters.
LPC2105FBD48 mcu crack
LPC2105FBD48 mcu crack， NXP ARM DECRYPTION, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options up to 64 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, PWM channels, and 32 GPIO lines make these microcontrollers particularly suitable for industrial control and medical systems.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
Due to their tiny size and low power consumption, these microcontrollers are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM options up to 64 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, PWM channels, and 32 GPIO lines make these microcontrollers particularly suitable for industrial control and medical systems.
LPC2104FBD48 mcu crack
LPC2104FBD48 mcu crack， NXP ARM DECRYPTION, ARM code extraction.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
The UART are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128 kB of embedded high speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty.
Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM
The UART are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 128 kB of embedded high speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty.
Monday, November 5, 2012
CY8C20496A-24LQXIT Microcontroller Reverse Engineering
CY8C20496A-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.
Flexible on-chip memory
Three program/data storage size options:
8 KB flash/1 KB SRAM
16 KB flash/2 KB SRAM
32 KB flash/2 KB SRAM
50,000 flash erase/write cycles
Partial flash updates
Flexible protection modes
In-system serial programming (ISSP)
Full-speed USB
12 Mbps USB 2.0 compliant
Precision, programmable clocking
Internal main oscillator (IMO): 6/12/24 MHz ± 5%
Internal low speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
Precision 32 kHz oscillator for optional external crystal
Programmable pin configurations
Up to 36 general-purpose I/Os (GPIOs) (depending on
package)
Flexible on-chip memory
Three program/data storage size options:
8 KB flash/1 KB SRAM
16 KB flash/2 KB SRAM
32 KB flash/2 KB SRAM
50,000 flash erase/write cycles
Partial flash updates
Flexible protection modes
In-system serial programming (ISSP)
Full-speed USB
12 Mbps USB 2.0 compliant
Precision, programmable clocking
Internal main oscillator (IMO): 6/12/24 MHz ± 5%
Internal low speed oscillator (ILO) at 32 kHz for watchdog
and sleep timers
Precision 32 kHz oscillator for optional external crystal
Programmable pin configurations
Up to 36 general-purpose I/Os (GPIOs) (depending on
package)
CY8C20496A-24LQXI Microcontroller Reverse Engineering
CY8C20496A-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.
Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
SPI master and slave: Configurable 46.9 kHz to 12 MHz
Three 16-bit timers
Watchdog and sleep timers
Integrated supervisory circuit
Emulated E2PROM using flash memory
Complete development tools
Free development tool (PSoC Designer?)
Full-featured, in-circuit emulator (ICE) and programmer
Full-speed emulation
Complex breakpoint structure
128 KB trace memory
Versatile package options
16-pin 3 × 3 × 0.6 mm QFN
24-pin 4 × 4 × 0.6 mm QFN
32-pin 5 × 5 × 0.6 mm QFN
48-pin SSOP
48-pin 7 × 7 × 1.0 mm QFN
30-ball WLCSP
Additional system resources
I2C slave:
Selectable to 50 kHz, 100 kHz, or 400 kHz
SPI master and slave: Configurable 46.9 kHz to 12 MHz
Three 16-bit timers
Watchdog and sleep timers
Integrated supervisory circuit
Emulated E2PROM using flash memory
Complete development tools
Free development tool (PSoC Designer?)
Full-featured, in-circuit emulator (ICE) and programmer
Full-speed emulation
Complex breakpoint structure
128 KB trace memory
Versatile package options
16-pin 3 × 3 × 0.6 mm QFN
24-pin 4 × 4 × 0.6 mm QFN
32-pin 5 × 5 × 0.6 mm QFN
48-pin SSOP
48-pin 7 × 7 × 1.0 mm QFN
30-ball WLCSP
CY8C20467-24LQXI Microcontroller Reverse Engineering
CY8C20467-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .
QuietZone? Controller
Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
Ideal for proximity solutions
Overlay thickness of 15 mm for glass and 5 mm plastic
Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
Reliable and robust touch performance in noisy environments
Standardized user modules for overcoming noise
Low power CapSense? block with SmartSense? auto-tuning
Supports a combination of up to 31 buttons or 6 sliders, proximity
sensors
Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
SmartSense auto-tuning
Sets and maintains optimal sensor performance during
runtime
Eliminates system tuning during development and production
Compensates for variations in manufacturing process
QuietZone? Controller
Patented Capacitive Sigma Delta PLUS (CSD PLUS?)
sensing algorithm for robust performance
High Sensitivity (0.1 pF) and best-in-class SNR performance
to support:
Ideal for proximity solutions
Overlay thickness of 15 mm for glass and 5 mm plastic
Superior noise immunity performance against conducted and
radiated noise and ultra low radiated emissions
Reliable and robust touch performance in noisy environments
Standardized user modules for overcoming noise
Low power CapSense? block with SmartSense? auto-tuning
Supports a combination of up to 31 buttons or 6 sliders, proximity
sensors
Low average power consumption - 28 ?A for each sensor at
runtime (wake from sleep and scan sensors every 125 ms)
SmartSense auto-tuning
Sets and maintains optimal sensor performance during
runtime
Eliminates system tuning during development and production
Compensates for variations in manufacturing process
CY8C20467-24LQXIT Microcontroller Reverse Engineering
CY8C20467-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .
Programmable pin configurations
Up to 32 general-purpose I/Os (GPIOs)
Dual mode GPIO
High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
Configurable internal pull-up, high-Z, and open drain modes
Selectable, regulated digital I/O on port 1
Configurable input threshold on port 1
Versatile analog mux
Common internal analog bus
Simultaneous connection of I/O
High power supply rejection ratio (PSRR) comparator
Low-dropout voltage regulator for all analog resources
Programmable pin configurations
Up to 32 general-purpose I/Os (GPIOs)
Dual mode GPIO
High sink current of 25 mA for each GPIO. Total 120 mA
maximum sink current per chip
5 mA source current on port 0 and 1 and 1 mA on port 2,3
and 4
Configurable internal pull-up, high-Z, and open drain modes
Selectable, regulated digital I/O on port 1
Configurable input threshold on port 1
Versatile analog mux
Common internal analog bus
Simultaneous connection of I/O
High power supply rejection ratio (PSRR) comparator
Low-dropout voltage regulator for all analog resources
CY8C20467S-24LQXI Microcontroller Reverse Engineering
CY8C20467S-24LQXI Microcontroller Reverse Engineering, chip decryption, mcu code extraction service .
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
The core
CapSense analog system
System resources
A common, versatile bus allows connection between I/O and the
analog system.
Each CY8C20x37/47/67/S PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 34 GPIOs are also included. The GPIOs
provide access to the MCU and analog mux.
The PSoC family consists of many devices with on-chip
controllers. These devices are designed to replace multiple
traditional MCU-based system components with one low-cost
single-chip programmable component. A PSoC device includes
configurable blocks of analog and digital logic, and
programmable interconnect. This architecture makes it possible
for you to create customized peripheral configurations, to match
the requirements of each individual application. Additionally, a
fast central processing unit (CPU), flash program memory,
SRAM data memory, and configurable I/O are included in a
range of convenient pinouts.
The architecture for this device family, as shown in the Logic
Block Diagram on page 2, consists of three main areas:
The core
CapSense analog system
System resources
A common, versatile bus allows connection between I/O and the
analog system.
Each CY8C20x37/47/67/S PSoC device includes a dedicated
CapSense block that provides sensing and scanning control
circuitry for capacitive sensing applications. Depending on the
PSoC package, up to 34 GPIOs are also included. The GPIOs
provide access to the MCU and analog mux.
CY8C20467S-24LQXIT Microcontroller Reverse Engineering
CY8C20467S-24LQXIT Microcontroller Reverse Engineering, chip decryption, mcu code extraction service.
CapSense System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. The analog system is composed of the
CapSense PSoC block and an internal 1 V or 1.2 V analog
reference, which together support capacitive sensing of up to 31
inputs[3]. Capacitive sensing is configurable on each GPIO pin.
Scanning of enabled CapSense pins is completed quickly and
easily across multiple ports.
SmartSense? Auto-tuning
SmartSense auto-tuning is an innovative solution from Cypress
that removes manual tuning of CapSense applications. This
solution is easy to use and provides robust noise immunity. It is
the only auto-tuning solution that establishes, monitors, and
maintains all required tuning parameters of each sensor during
run time. SmartSense auto-tuning allows engineers to go from
prototyping to mass production without retuning for
manufacturing variations in PCB and/or overlay material
properties.
CapSense System
The analog system contains the capacitive sensing hardware.
Several hardware algorithms are supported. This hardware
performs capacitive sensing and scanning without requiring
external components. The analog system is composed of the
CapSense PSoC block and an internal 1 V or 1.2 V analog
reference, which together support capacitive sensing of up to 31
inputs[3]. Capacitive sensing is configurable on each GPIO pin.
Scanning of enabled CapSense pins is completed quickly and
easily across multiple ports.
SmartSense? Auto-tuning
SmartSense auto-tuning is an innovative solution from Cypress
that removes manual tuning of CapSense applications. This
solution is easy to use and provides robust noise immunity. It is
the only auto-tuning solution that establishes, monitors, and
maintains all required tuning parameters of each sensor during
run time. SmartSense auto-tuning allows engineers to go from
prototyping to mass production without retuning for
manufacturing variations in PCB and/or overlay material
properties.
Thursday, October 18, 2012
CY7C1041CV33-20VXE code extraction
CY7C1041CV33-20VXE code extraction, chip decryption, mcu crack,
dsp crack .
The CY7C1041CV33 Automotive is a high performance CMOS
static RAM organized as 262,144 words by 16 bits.
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on I/O0
to I/O7
. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8
to I/O15
. For more information, see the Truth
Table on page 11 for a complete description of Read and Write
modes.
The input and output pins (I/O0
through I/O15
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).
dsp crack .
The CY7C1041CV33 Automotive is a high performance CMOS
static RAM organized as 262,144 words by 16 bits.
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on I/O0
to I/O7
. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8
to I/O15
. For more information, see the Truth
Table on page 11 for a complete description of Read and Write
modes.
The input and output pins (I/O0
through I/O15
) are placed in a
high impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW
and WE LOW).
CY7C1041CV33-20VXE code extraction
CY7C1041CV33-20VXE code extraction, chip decryption, mcu crack,
dsp crack .
4-Mbit (256 K × 16) Static RAM
Features
Temperature ranges
Automotive-A: –40 °C to 85 °C
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1041BNV33
High speed
tAA = 10 ns (Automotive-A)
tAA = 10 ns (Automotive-E)
Low active power
432 mW (max)
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free and non Pb-free 44-pin 400 Mil SOJ, 44-pin
TSOP II and 48-ball FBGA packages
dsp crack .
4-Mbit (256 K × 16) Static RAM
Features
Temperature ranges
Automotive-A: –40 °C to 85 °C
Automotive-E: –40 °C to 125 °C
Pin and function compatible with CY7C1041BNV33
High speed
tAA = 10 ns (Automotive-A)
tAA = 10 ns (Automotive-E)
Low active power
432 mW (max)
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free and non Pb-free 44-pin 400 Mil SOJ, 44-pin
TSOP II and 48-ball FBGA packages
CY7C1041D-10VXIT code extraction
CY7C1041D-10VXIT code extraction, chip decryption, mcu crack,
dsp crack .
The CY7C1041D is a high-performance CMOS static RAM
organized as 256K words by 16 bits. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0
to I/O7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8
to I/O15
. See the truth table
at the back of this data sheet for a complete description of
read
and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1041D is available in a standard 44-pin 400-mil-wide
body width SOJ and 44-pin TSOP II package with center power
and ground (revolutionary) pinout.
CY7C1041D-10VXIT code extraction
CY7C1041D-10VXIT code extraction, chip decryption, mcu crack, dsp crack .
The CY7C1041D is a high-performance CMOS static RAM
organized as 256K words by 16 bits. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0
to I/O7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8
to I/O15
. See the truth table
at the back of this data sheet for a complete description of read
and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1041D is available in a standard 44-pin 400-mil-wide
body width SOJ and 44-pin TSOP II package with center power
and ground (revolutionary) pinout.
The CY7C1041D is a high-performance CMOS static RAM
organized as 256K words by 16 bits. Writing to the device is
accomplished by taking Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0
through I/O7
), is written into the location
specified on the address pins (A0
through A17
). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8
through
I/O15
) is written into the location specified on the address pins
(A0
through A17
).
Reading from the device is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O0
to I/O7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O8
to I/O15
. See the truth table
at the back of this data sheet for a complete description of read
and write modes.
The input/output pins (I/O0
through I/O15
) are placed in a
high-impedance state when the device is deselected (CE HIGH),
the outputs are disabled (OE HIGH), the BHE and BLE are
disabled (BHE, BLE HIGH), or during a write operation (CE LOW,
and WE LOW).
The CY7C1041D is available in a standard 44-pin 400-mil-wide
body width SOJ and 44-pin TSOP II package with center power
and ground (revolutionary) pinout.
CY7C1041DV33-10BVXIT code extraction
CY7C1041DV33-10BVXIT code extraction, chip decryption, mcu crack, dsp crack .
Features
Temperature ranges
Industrial: –40 °C to 85 °C
Pin and function compatible with CY7C1041CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power-down when deselected
TTL compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 48-ball VFBGA, 44-pin (400-mil) molded
SOJ, and 44-pin TSOP II Packages
Features
Temperature ranges
Industrial: –40 °C to 85 °C
Pin and function compatible with CY7C1041CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power-down when deselected
TTL compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 48-ball VFBGA, 44-pin (400-mil) molded
SOJ, and 44-pin TSOP II Packages
CY7C1010DV33-10ZSXI code extraction
CY7C1010DV33-10ZSXI code extraction, chip decryption, mcu crack,
dsp crack .
Features
Pin and function compatible with CY7C1010CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA at 10 ns
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 36-pin SOJ and 44-pin TSOP II packages
dsp crack .
Features
Pin and function compatible with CY7C1010CV33
High speed
tAA = 10 ns
Low active power
ICC = 90 mA at 10 ns
Low CMOS standby power
ISB2
= 10 mA
2.0 V data retention
Automatic power down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE and OE features
Available in Pb-free 36-pin SOJ and 44-pin TSOP II packages
Tuesday, October 16, 2012
CY7C026A-20AXCT MCU Code Reading
CY7C026A-20AXCT MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
The CY7C026A is a low power CMOS 16K x 16 dual-port static
RAM. Various arbitration schemes are included on the devices
to handle situations when multiple processors access the same
piece of data. Two ports are provided, permitting independent,
asynchronous access for reads and writes to any location in
memory. The device can be utilized as standalone 16-bit
dual-port static RAM or multiple devices can be combined to
function as a 32-bit or wider master/slave dual-port static RAM.
An M/S pin is provided for implementing 32-bit or wider memory
applications without the need for separate master and slave
devices or additional discrete logic. Application areas include
interprocessor/multiprocessor designs, communications status
buffering, and dual-port video/graphics memory.
Each port has independent control pins: Chip Enable (CE), Read
or Write Enable (R/W), and Output Enable (OE). Two flags are
provided on each port (BUSY and INT). BUSY signals that the
port is trying to access the same location currently being
accessed by the other port. The Interrupt flag (INT) permits
communication between ports or systems by means of a mail
box. The semaphores are used to pass a flag, or token, from one
port to the other to indicate that a shared resource is in use.
The
semaphore logic is comprised of eight shared latches. Only one
side can control the latch (semaphore) at any time. Control of a
semaphore indicates that a shared resource is in use. An
automatic power down feature is controlled independently on
each port by the chip enable pin.
The CY7C026A is available in 100-pin thin quad plastic flatpack
(TQFP) packages.
CY7C026AV-25AC MCU Code Reading
CY7C026AV-25AC MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which enable simultaneous
access of the same memory location
4, 8 or 16 K × 16 organization
(CY7C024AV/025AV/026AV)
0.35 micron CMOS for optimum speed and power
High speed access: 20 ns and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master and Slave
chip select when using more than one device
On chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper byte and lower byte control
Pin select for Master or Slave (M/S)
Commercial and industrial temperature ranges
Available in 100-pin Pb-free TQFP and 100-pin TQFP
Chip Decryption.
Features
True dual-ported memory cells which enable simultaneous
access of the same memory location
4, 8 or 16 K × 16 organization
(CY7C024AV/025AV/026AV)
0.35 micron CMOS for optimum speed and power
High speed access: 20 ns and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master and Slave
chip select when using more than one device
On chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper byte and lower byte control
Pin select for Master or Slave (M/S)
Commercial and industrial temperature ranges
Available in 100-pin Pb-free TQFP and 100-pin TQFP
CY7C027AV-25AXI MCU Code Reading
CY7C027AV-25AXI MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
[1]
)
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
Chip Decryption.
Features
True dual-ported memory cells which allow
simultaneous access of the same memory location
32K x 16 organization (CY7C027V/027AV
[1]
)
64K x 16 organization (CY7C028V)
32K x 18 organization (CY7C037AV)
64K x 18 organization (CY7C038V)
0.35 micron Complementary metal oxide semiconductor
(CMOS) for optimum speed and power
High speed access: 15, 20, and 25 ns
Low operating power
Active: ICC = 115 mA (typical)
Standby: ISB3
= 10 A (typical)
Fully asynchronous operation
Automatic power-down
Expandable data bus to 32/36 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flag for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and Industrial temperature ranges
100-pin Pb-free Thin quad plastic flatpack (TQFP) and 100-pin
TQFP
CY7C027-20AXIT MCU Code Reading
CY7C027-20AXIT MCU Code Reading, Programm Reading, MCU Crack,
Chip Decryption.
Features
True dual-ported memory cells which allow simultaneous
access of the same memory location
32 K × 16 organization (CY7C027)
64 K × 16 organization (CY7C028)
0.35 micron CMOS for optimum speed and power
High speed access: 15 and 20 ns
Low operating power
Active: ICC = 180 mA (typical)
Standby: ISB3
= 0.05 mA (typical)
Fully asynchronous operation
Automatic power down
Expandable data bus to 32 bits or more using Master/Slave
chip select when using more than one device
On-chip arbitration logic
Semaphores included to permit software handshaking
between ports
INT flags for port-to-port communication
Separate upper-byte and lower-byte control
Dual chip enables
Pin select for Master or Slave
Commercial and industrial temperature ranges
Available in 100-pin TQFP
Pb-free packages available
Monday, September 17, 2012
Hardware Specifications SuperPro 3070
Hardware Specifications
ISP cable accommodates I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 interfaces.
Cable driver circuit supports target voltage level of 1.5-5V and is also ESD protected.
USB 2.0 interface for PC connection and management of project files on SD card.
SuperPro 3070 Detailed Features
Detailed Features
Supports 6796 IC devices from 144 manufacturers and continuing
High speed ARM9 CPU based hardware engine. Programming speed adjustable for complicated application environments brought by user target board.
Supports ISP programming of devices with I2C, SPI, CAN, UART, BDM, MW, JTAG, or any other serial port.
Internal Linux O/S.
Two operation modes: Stand-alone and PC-Host mode.
DLL, API or Virtual Com communication command set available for third party application (Optional).
USB 2.0 interface to PC for data communication and control.
Over-current and ESD protection to protect your equipment.
Comes with one-year free device update request support unless there is no PCB testing (engineering labor) involved
Over-current protection circuit limits power to the target device.
Serial number is written within the built-in flash memory, which will be displayed when powered on.
SuperPro 3070
SuperPro 3070 is developed based on IS01 In-System Programmer. It is designed for Agilent Medalist i3070 Mux System .The features are very similar to IS01. The user may create project files with IS01 Software, and then operate the programmer through i3070 Mux System.
SuperPro 3070
SuperPro 3070 is developed based on IS01 In-System Programmer. It is designed for Agilent Medalist i3070 Mux System .The features are very similar to IS01. The user may create project files with IS01 Software, and then operate the programmer through i3070 Mux System.
Detailed Features
Supports 6796 IC devices from 144 manufacturers and continuing
High speed ARM9 CPU based hardware engine. Programming speed adjustable for complicated application environments brought by user target board.
Supports ISP programming of devices with I2C, SPI, CAN, UART, BDM, MW, JTAG, or any other serial port.
Internal Linux O/S.
Two operation modes: Stand-alone and PC-Host mode.
DLL, API or Virtual Com communication command set available for third party application (Optional).
USB 2.0 interface to PC for data communication and control.
Over-current and ESD protection to protect your equipment.
Comes with one-year free device update request support unless there is no PCB testing (engineering labor) involved
Over-current protection circuit limits power to the target device.
Serial number is written within the built-in flash memory, which will be displayed when powered on.
Hardware Specifications
ISP cable accommodates I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 interfaces.
Cable driver circuit supports target voltage level of 1.5-5V and is also ESD protected.
USB 2.0 interface for PC connection and management of project files on SD card.
Software Specifications
Supports 5,000+ serial devices.
Supports Jam and Staple files from ACTEL and ALTERA; Direct C files from ACTEL.
Programming speed is selectable (High, Normal and Low) for compatibility with target environment and cable length
Dynamic buffer function. Application examples include: device serial number, MAC address, frequency or transducer calibration, etc.
File format on SD card: FAT16, FAT32
Functions for IP protection: Project security, SD card security, batch control, administration management, etc.
API and DLL are available for easy integration into customer systems such as ICT or ATE (option).
Multiple unit operation via USB Hub
Application
R&D applications like in-circuit tests and debugging.
Volume production- Devices may be programmed after the board is fully assembled. One example is writing the serial number to an on-board serial device.
Field application- Comes with portability, stand-alone mode, and an SD card. It is suitable for field tests, debugging and data acquisition.
Detailed Features
Supports 6796 IC devices from 144 manufacturers and continuing
High speed ARM9 CPU based hardware engine. Programming speed adjustable for complicated application environments brought by user target board.
Supports ISP programming of devices with I2C, SPI, CAN, UART, BDM, MW, JTAG, or any other serial port.
Internal Linux O/S.
Two operation modes: Stand-alone and PC-Host mode.
DLL, API or Virtual Com communication command set available for third party application (Optional).
USB 2.0 interface to PC for data communication and control.
Over-current and ESD protection to protect your equipment.
Comes with one-year free device update request support unless there is no PCB testing (engineering labor) involved
Over-current protection circuit limits power to the target device.
Serial number is written within the built-in flash memory, which will be displayed when powered on.
Hardware Specifications
ISP cable accommodates I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 interfaces.
Cable driver circuit supports target voltage level of 1.5-5V and is also ESD protected.
USB 2.0 interface for PC connection and management of project files on SD card.
Software Specifications
Supports 5,000+ serial devices.
Supports Jam and Staple files from ACTEL and ALTERA; Direct C files from ACTEL.
Programming speed is selectable (High, Normal and Low) for compatibility with target environment and cable length
Dynamic buffer function. Application examples include: device serial number, MAC address, frequency or transducer calibration, etc.
File format on SD card: FAT16, FAT32
Functions for IP protection: Project security, SD card security, batch control, administration management, etc.
API and DLL are available for easy integration into customer systems such as ICT or ATE (option).
Multiple unit operation via USB Hub
Application
R&D applications like in-circuit tests and debugging.
Volume production- Devices may be programmed after the board is fully assembled. One example is writing the serial number to an on-board serial device.
Field application- Comes with portability, stand-alone mode, and an SD card. It is suitable for field tests, debugging and data acquisition.
Thursday, September 13, 2012
xeltek SuperPro 5000
xeltek SuperPro 5000 Universal IC Chip Device Programmer
SKU SP5K
Weight 7.00 lbs
Number of Devices Supported 83,100+
Number of Manufacturers Supported 297
Number of Pins Available 144
Stand-Alone (PC-Free) Yes
Built-in Processor ARM7 RISC MCU
Free User Requested Device Update Yes
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
Highlights
Two programmers in one, a double value: PC mode for engineering and Stand-alone mode for production. The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY keypad.
A CF (compact flash) card stores the project files.
Ultra-Fast Programming Speed: Programs and verifies 64 Mb NOR Flash memory in 11.3 seconds and 1 Gb NAND Flash in 108 seconds.
Built-in 144 universal pin drivers
Comes with free device update request support within the warranty period.
CE and RoHS Compliant
Expanded Features
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs and verifies 64 Mb NOR FLASH memory in 11.3 seconds and 1 GB NAND in 108 seconds.
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via
20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Hardware & electrical Specifications
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A
Main unit: Dimensions 148(L) * 216(W) * 94(h) mm; Weight 3.5 lbs (1.6 Kg)
Package: Dimensions 301(L) * 252(W) * 145(H) mm; Weight 6.2 lbs (2.8Kg)
Items Included
SuperPro 5000 Programmer with a DIP48 Adapter
AC adapter
Software CD
USB Cable
Optional Accessories:
Socket Adapters in various packages
CF card for stand-alone operation
ISP Header for serial programming
SKU SP5K
Weight 7.00 lbs
Number of Devices Supported 83,100+
Number of Manufacturers Supported 297
Number of Pins Available 144
Stand-Alone (PC-Free) Yes
Built-in Processor ARM7 RISC MCU
Free User Requested Device Update Yes
Windows Support Win XP/Vista/7 32/64 bit
RoHS & CE Compliance Yes
Warranty 2 Years
Highlights
Two programmers in one, a double value: PC mode for engineering and Stand-alone mode for production. The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY keypad.
A CF (compact flash) card stores the project files.
Ultra-Fast Programming Speed: Programs and verifies 64 Mb NOR Flash memory in 11.3 seconds and 1 Gb NAND Flash in 108 seconds.
Built-in 144 universal pin drivers
Comes with free device update request support within the warranty period.
CE and RoHS Compliant
Expanded Features
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs and verifies 64 Mb NOR FLASH memory in 11.3 seconds and 1 GB NAND in 108 seconds.
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via
20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Hardware & electrical Specifications
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A
Main unit: Dimensions 148(L) * 216(W) * 94(h) mm; Weight 3.5 lbs (1.6 Kg)
Package: Dimensions 301(L) * 252(W) * 145(H) mm; Weight 6.2 lbs (2.8Kg)
Items Included
SuperPro 5000 Programmer with a DIP48 Adapter
AC adapter
Software CD
USB Cable
Optional Accessories:
Socket Adapters in various packages
CF card for stand-alone operation
ISP Header for serial programming
Highlight of 7000
Ultra-Fast Programming Speed: Programs 30% faster than SuperPro 5000 programmers
Two programmers in one, a double value: PC mode for engineering and Stand-alone mode for production. The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY keypad.
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes.
Built-in 144 universal pin drivers
Comes with one-year free device update request support.
CE and RoHS Compliant
Expanded Features OF 7000
Expanded Features
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs 30% faster than SuperPro 5000 programmers
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs 30% faster than SuperPro 5000 programmers
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Hardware & Electrical Specifications OF 7000
Hardware & Electrical Specifications
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, etc...
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 90V- 250V; Output: 12V/1.5A; Power:15W
Main unit: Dimensions 184(L) * 160(W) * 78(h) mm; Weight 1.8 lbs (0.8 Kg)
Package: Dimensions 310(L) * 250(W) * 145(H) mm; Weight 3.6 lbs (1.65 Kg)
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, etc...
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 90V- 250V; Output: 12V/1.5A; Power:15W
Main unit: Dimensions 184(L) * 160(W) * 78(h) mm; Weight 1.8 lbs (0.8 Kg)
Package: Dimensions 310(L) * 250(W) * 145(H) mm; Weight 3.6 lbs (1.65 Kg)
xeltek SuperPro 7000 Programmer
xeltek SuperPro 7000 Programmer
Ultra-Fast Programming Speed: Programs 30% faster than SuperPro 5000 programmers
Two programmers in one, a double value: PC mode for engineering and Stand-alone mode for production. The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY keypad.
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes.
Built-in 144 universal pin drivers
Comes with one-year free device update request support.
CE and RoHS Compliant
Expanded Features
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs 30% faster than SuperPro 5000 programmers
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Hardware & Electrical Specifications
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, etc...
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 90V- 250V; Output: 12V/1.5A; Power:15W
Main unit: Dimensions 184(L) * 160(W) * 78(h) mm; Weight 1.8 lbs (0.8 Kg)
Package: Dimensions 310(L) * 250(W) * 145(H) mm; Weight 3.6 lbs (1.65 Kg)
Items Included
SuperPro 7000 Programmer with a DIP48 Adapter
AC adapter
Software CD
USB Cable
Optional Accessories:
Socket Adapters in various packages
CF card for stand-alone operation
ISP Header for serial programming
Ultra-Fast Programming Speed: Programs 30% faster than SuperPro 5000 programmers
Two programmers in one, a double value: PC mode for engineering and Stand-alone mode for production. The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY keypad.
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes.
Built-in 144 universal pin drivers
Comes with one-year free device update request support.
CE and RoHS Compliant
Expanded Features
Programs devices with Vcc as low as 1.2V.
Ultra fast programming speed: Programs 30% faster than SuperPro 5000 programmers
Built with 144 universal pin-drivers for support of today's most complex devices. Universal and device independent socket adapters are available for various packages up to 144 pins.
The programmer operates in either PC hosted mode or stand-alone mode.
Under PC hosted mode, a PC controls the programmer via a high-speed USB2.0 connection to program a chip.
Under stand-alone mode, the user controls the programmer via 20-characters, 4-line LCD display with 6-KEY
A CF (compact flash) card stores the project files.
The programmer support devices up to 256 GBytes
ISP/ICP programming capability through optional ISP/ICP adapter.
In stand-alone mode, the user can operate multiple units to construct a concurrent multiprogramming system.
Over-current and over-voltage protection for safety of the chip and programmer hardware.
Compatible with Windows 7 & Vista & XP 32/64 bit
Only IC manufacturer approved programming algorithms provide high reliability.
Vcc verification at (+5%~-5%) and (10%~-10%) enhances programming reliability.
Includes the following advanced and powerful software functions:
Chip operation starts immediately upon proper chip insertion in Production Mode.
Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one step.
Password protection provides security for project files and production volume control.
Batch command combines device operations like program, verify, security into a single command at any sequence.
Serial number generators are available as standard or customer-specific functions.
Log file provides production quality tracking.
Hardware & Electrical Specifications
Devices Supported: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU, etc...
Package: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...
PC interface: USB2.0 (High speed)
Stand-alone memory: Compact FLASH Card
Power supply: AC Adapter: Input AC 90V- 250V; Output: 12V/1.5A; Power:15W
Main unit: Dimensions 184(L) * 160(W) * 78(h) mm; Weight 1.8 lbs (0.8 Kg)
Package: Dimensions 310(L) * 250(W) * 145(H) mm; Weight 3.6 lbs (1.65 Kg)
Items Included
SuperPro 7000 Programmer with a DIP48 Adapter
AC adapter
Software CD
USB Cable
Optional Accessories:
Socket Adapters in various packages
CF card for stand-alone operation
ISP Header for serial programming
Monday, September 10, 2012
ATxmega384D3 MCU code extraction
ATxmega384D3 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 384KB in-system programmable flash
memory (8KB boot code section) with read-while-write
capabilities, 4KB EEPROM, 32KB SRAM, a four-channel event
system, a programmable multi-level interrupt controller, 50
general purpose I/O lines, a 16-bit real time counter, five
flexible 16-bit timer/counters with compare, compare and PWM
channels, three USARTs, two two-wire interfaces, two serial
peripheral interfaces, one 16-channel/12-bit ADC programmable
gain, two analog comparators with window mode, a programmable
watchdog timer with separate internal oscillator, accurate
internal oscillators with PLL and prescaler, and a programmable
brown-out detection.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 384KB in-system programmable flash
memory (8KB boot code section) with read-while-write
capabilities, 4KB EEPROM, 32KB SRAM, a four-channel event
system, a programmable multi-level interrupt controller, 50
general purpose I/O lines, a 16-bit real time counter, five
flexible 16-bit timer/counters with compare, compare and PWM
channels, three USARTs, two two-wire interfaces, two serial
peripheral interfaces, one 16-channel/12-bit ADC programmable
gain, two analog comparators with window mode, a programmable
watchdog timer with separate internal oscillator, accurate
internal oscillators with PLL and prescaler, and a programmable
brown-out detection.
ATxmega384C3 MCU code extraction
ATxmega384C3 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 384KB in-system programmable flash
memory (8KB boot code section) with read-while-write
capabilities, 4KB EEPROM, 32KB SRAM, a two-channel DMA
controller, a four-channel event system, a programmable multi-
level interrupt controller, 50 general purpose I/O lines, a 16-
bit real time counter, five flexible 16-bit timer/counters with
compare, compare and PWM channels, USB Full-speed Device, three
USARTs, two two-wire interfaces, two serial peripheral
interfaces, one 16-channel/12-bit ADC programmable gain, two
analog comparators with window mode, a programmable watchdog
timer with separate internal oscillator, accurate internal
oscillators with PLL and prescaler, and a programmable brown-out
detection.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 384KB in-system programmable flash
memory (8KB boot code section) with read-while-write
capabilities, 4KB EEPROM, 32KB SRAM, a two-channel DMA
controller, a four-channel event system, a programmable multi-
level interrupt controller, 50 general purpose I/O lines, a 16-
bit real time counter, five flexible 16-bit timer/counters with
compare, compare and PWM channels, USB Full-speed Device, three
USARTs, two two-wire interfaces, two serial peripheral
interfaces, one 16-channel/12-bit ADC programmable gain, two
analog comparators with window mode, a programmable watchdog
timer with separate internal oscillator, accurate internal
oscillators with PLL and prescaler, and a programmable brown-out
detection.
ATxmega32D4 MCU code extraction
ATxmega32D4 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 32KB ISP flash memory (4KB boot code
section) with read-while-write capabilities, 1KB EEPROM, 4KB
SRAM, four-channel event system, a programmable multi-level
interrupt controller, 34 general purpose I/O lines, a 16-bit
real time counter, four flexible 16-bit timer/counters with
compare modes and PWM, two USARTs, two Two-Wire Interfaces
(TWIs), two Serial Peripheral Interfaces (SPIs), one 12-
channel/12-bit A/D converter with optional differential input
with programmable gain, two analog comparators with window mode,
a programmable watchdog timer with separate internal oscillator,
accurate internal oscillators with PLL and prescaler, and
programmable brown-out detection. The Program and Debug
Interface (PDI), a fast 2-pin interface for programming and
debugging, is available. By executing powerful instructions in a
single clock cycle, the device achieves throughputs approaching
1 MIPS per MHz, balancing power consumption and processing
speed.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance, low-power 8/16-bit AVR XMEGA
microcontroller combines 32KB ISP flash memory (4KB boot code
section) with read-while-write capabilities, 1KB EEPROM, 4KB
SRAM, four-channel event system, a programmable multi-level
interrupt controller, 34 general purpose I/O lines, a 16-bit
real time counter, four flexible 16-bit timer/counters with
compare modes and PWM, two USARTs, two Two-Wire Interfaces
(TWIs), two Serial Peripheral Interfaces (SPIs), one 12-
channel/12-bit A/D converter with optional differential input
with programmable gain, two analog comparators with window mode,
a programmable watchdog timer with separate internal oscillator,
accurate internal oscillators with PLL and prescaler, and
programmable brown-out detection. The Program and Debug
Interface (PDI), a fast 2-pin interface for programming and
debugging, is available. By executing powerful instructions in a
single clock cycle, the device achieves throughputs approaching
1 MIPS per MHz, balancing power consumption and processing
speed.
Friday, September 7, 2012
AT32UC3L0256 MCU code extraction
AT32UC3L0256 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance 32-bit AVR microcontroller is designed for
cost-sensitive embedded applications that require low power
consumption, high code density, and high performance.
The microcontroller's Memory Protection Unit (MPU) and fast,
flexible interrupt controller support the latest real-time
operating systems. The Secure Access Unit (SAU) with MPU provide
enhanced security and integrity. Higher computation capability
is achieved using a rich set of DSP instructions.
The microcontroller embeds state-of-the-art picoPower technology
for ultra-low power consumption. A combination of power control
techniques bring active current consumption down to 165µA/MHz
and leakage down to 9nA while still retaining a bank of backup
registers. The device offers a wide range of trade-offs between
functionality and power consumption to reach the lowest possible
power usage for the application's required feature set.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance 32-bit AVR microcontroller is designed for
cost-sensitive embedded applications that require low power
consumption, high code density, and high performance.
The microcontroller's Memory Protection Unit (MPU) and fast,
flexible interrupt controller support the latest real-time
operating systems. The Secure Access Unit (SAU) with MPU provide
enhanced security and integrity. Higher computation capability
is achieved using a rich set of DSP instructions.
The microcontroller embeds state-of-the-art picoPower technology
for ultra-low power consumption. A combination of power control
techniques bring active current consumption down to 165µA/MHz
and leakage down to 9nA while still retaining a bank of backup
registers. The device offers a wide range of trade-offs between
functionality and power consumption to reach the lowest possible
power usage for the application's required feature set.
AT32UC3L032 MCU code extraction
AT32UC3L032 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance 32-bit AVR microcontroller is designed for
cost-sensitive embedded applications that require low power
consumption, high code density, and high performance.
The microcontroller's Memory Protection Unit (MPU) and fast,
flexible interrupt controller support the latest real-time
operating systems. The Secure Access Unit (SAU) with MPU provide
enhanced security and integrity. Higher computation capability
is achieved using a rich set of DSP instructions.
The microcontroller embeds state-of-the-art picoPower technology
for ultra-low power consumption. A combination of power control
techniques bring active current consumption down to 165µA/MHz
and leakage down to 9nA while still retaining a bank of backup
registers. The device offers a wide range of trade-offs between
functionality and power consumption to reach the lowest possible
power usage for the application's required feature set.
AT32UC3L064 MCU code extraction
AT32UC3L064 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
The high-performance 32-bit AVR microcontroller is designed for cost-sensitive embedded applications that require low power consumption, high code density, and high performance.
The microcontroller's Memory Protection Unit (MPU) and fast, flexible interrupt controller support the latest real-time operating systems. The Secure Access Unit (SAU) with MPU provide enhanced security and integrity. Higher computation capability is achieved using a rich set of DSP instructions.
The microcontroller embeds state-of-the-art picoPower technology for ultra-low power consumption. A combination of power control techniques bring active current consumption down to 165µA/MHz and leakage down to 9nA while still retaining a bank of backup registers. The device offers a wide range of trade-offs between functionality and power consumption to reach the lowest possible power usage for the application's required feature set.
AT80C51RD2 MCU code extraction
AT80C51RD2 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance version of the 80C51 8-bit microcontrollers that retains all features of the 80C52 adn adds programmable counter array, 1024 bytes of XRAM, hardware watchdog timer, keyboard interface, versatile serial channel that facilitates multiprocessor communication (EUART), and a speed improvement mechanism (X2 mode).
The device has two software-selectable modes of reduced activity and an 8-bit clock prescaler to further reduce power consumption. In idle mode, the CPU is frozen while the peripherals and the interrupt system operate. In the power-down mode, the RAM is saved and all other functions are inoperative.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance version of the 80C51 8-bit microcontrollers that retains all features of the 80C52 adn adds programmable counter array, 1024 bytes of XRAM, hardware watchdog timer, keyboard interface, versatile serial channel that facilitates multiprocessor communication (EUART), and a speed improvement mechanism (X2 mode).
The device has two software-selectable modes of reduced activity and an 8-bit clock prescaler to further reduce power consumption. In idle mode, the CPU is frozen while the peripherals and the interrupt system operate. In the power-down mode, the RAM is saved and all other functions are inoperative.
AT83C5134 MCU code extraction
AT83C5134 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
AT83C5135 MCU code extraction
AT83C5135 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
AT83C5136 MCU code extraction
AT83C5136 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
High-performance ROM version of the 80C51 single-chip, 8-bit microcontroller with full-speed USB functions. It is pin-compatible with AT89C5130A 16-KB and AT89C5131A 32-KB ISP flash microcontrollers, allowing those devices be used for development and pre-production while this device can be used in mass production to reduce costs.
It features a full-speed USB module that is compatible with the USB specification version 2.0. This module integrates the USB transceivers and the serial interface engine with digital phase locked loop and 48-MHz clock recovery. It also includes USB event detection logic and FIFO buffers supporting the mandatory control endpoint and five versatile endpoints with minimum software overhead.
The device retains the features of the Atmel 80C52 and adds 1024 bytes of on-chip ERAM, a dual data pointer, a 16-bit up/down timer, a programmable counter array, up to four programmable LED current sources, a programmable hardware watchdog, and a power-on reset.
AT83EB5114 MCU code extraction
AT83EB5114 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
Dedicated to lighting control applications, this device retains all the features of the standard 80C51 with 4KB of ROM program memory, 256 bytes RAM, 256 bytes EEPROM, a 7-source, 4-level interrupt system, an on chip oscillator and two timers/counters.
Analog functions include a 10-bit, 6-channel A/D converter and two optimized PWM units.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
Dedicated to lighting control applications, this device retains all the features of the standard 80C51 with 4KB of ROM program memory, 256 bytes RAM, 256 bytes EEPROM, a 7-source, 4-level interrupt system, an on chip oscillator and two timers/counters.
Analog functions include a 10-bit, 6-channel A/D converter and two optimized PWM units.
AT86RF212 MCU code extraction
AT86RF212 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
Low-power, low-voltage 700/800/900MHz transceiver designed for low-cost IEEE 802.15.4, ZigBee and high data rate ISM applications available in China, Europe and North America. The transceiver offers an extreme 120 dB link budget (-110 dBm receiver sensitivity / +10 dBm transmit power). It is a true SPI-to-antenna solution providing a complete radio transceiver interface between the antenna and the microcontroller. MAC and AES hardware accelerators improve overall system power efficiency and timing.
It comprises the analog radio transceiver and the digital demodulation including time and frequency synchronization, and data buffering. All RF-critical components are integrated on a single chip minimizing the number of required external components to the antenna, crystal and decoupling capacitors. The bidirectional differential antenna pins, used for transmission and reception, eliminate the need for an external antenna switch.
An internal 128 byte RAM buffers transmit and receive data. Two on chip low dropout (LDO) voltage regulators provide the internal analog and digital 1.8V supply.
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
Low-power, low-voltage 700/800/900MHz transceiver designed for low-cost IEEE 802.15.4, ZigBee and high data rate ISM applications available in China, Europe and North America. The transceiver offers an extreme 120 dB link budget (-110 dBm receiver sensitivity / +10 dBm transmit power). It is a true SPI-to-antenna solution providing a complete radio transceiver interface between the antenna and the microcontroller. MAC and AES hardware accelerators improve overall system power efficiency and timing.
It comprises the analog radio transceiver and the digital demodulation including time and frequency synchronization, and data buffering. All RF-critical components are integrated on a single chip minimizing the number of required external components to the antenna, crystal and decoupling capacitors. The bidirectional differential antenna pins, used for transmission and reception, eliminate the need for an external antenna switch.
An internal 128 byte RAM buffers transmit and receive data. Two on chip low dropout (LDO) voltage regulators provide the internal analog and digital 1.8V supply.
AT86RF230 MCU code extraction
AT86RF230 MCU code extraction, Chip decryption, MCU code
extraction,Atmel IC reverse, atmel DSP Crack, PCB cloning ,PCB
copying.
Low-power 2.4GHz transceiver designed for low cost IEEE802.15.4, ZigBee, RF4CE, SP100, WirelessHART™ and ISM applications. It is a true SPI-to-antenna solution providing a complete radio transceiver interface between the antenna and the microcontroller.
It comprises the analog radio transceiver and the digital demodulation including time and frequency synchronization, and data buffering. All RF-critical components are integrated on a single chip minimizing the number of required external components to the antenna, crystal and decoupling capacitors. The bidirectional differential antenna pins, used for transmission and reception, eliminate the need for an external antenna switch.
An internal 128 byte RAM buffers transmit and receive data. Two on chip low dropout (LDO) voltage regulators provide the internal analog and digital 1.8V supply.
Wednesday, August 29, 2012
MC68HC08JK3 crack
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Wednesday, August 15, 2012
Resources
Resources:
Codec Engine Algorithm Creator User's Guide (SPRUED6)
QualiTI (XDAIS validation tool)
RTSC codec packaging wizard
DAIS-DM (Digital Media) User Guide (SPRUEC8)
XDM API Reference - also in $(XDAIS_INSTALL_DIR)/docs/html/index.html
TMS320 DSP Algorithm Standard Rules and Guidelines (SPRU352)
TMS320 DSP Algorithm Standard API Reference (SPRU360)
TMS320 DSP Algorithm Standard Developer’s Guide (SPRU424)
Example codecs. $(XDAIS_INSTALL_DIR)/examples and $(CE_INSTALL_DIR)/examples
If creating a new VISA-like API/SPI (System Programming Interface) for a new class of algorithms
Consider IUNIVERSAL first!
Codec Engine SPI Reference Guide - also in $(CE_INSTALL_DIR)/docs/spi/html/index.html
Scale example. Codec in $(CE_INSTALL_DIR)/examples/.../codecs/scale and VISA extension support in $(CE_INSTALL_DIR)/examples/...extensions/scale
Codec Engine Algorithm Creator User's Guide (SPRUED6)
QualiTI (XDAIS validation tool)
RTSC codec packaging wizard
DAIS-DM (Digital Media) User Guide (SPRUEC8)
XDM API Reference - also in $(XDAIS_INSTALL_DIR)/docs/html/index.html
TMS320 DSP Algorithm Standard Rules and Guidelines (SPRU352)
TMS320 DSP Algorithm Standard API Reference (SPRU360)
TMS320 DSP Algorithm Standard Developer’s Guide (SPRU424)
Example codecs. $(XDAIS_INSTALL_DIR)/examples and $(CE_INSTALL_DIR)/examples
If creating a new VISA-like API/SPI (System Programming Interface) for a new class of algorithms
Consider IUNIVERSAL first!
Codec Engine SPI Reference Guide - also in $(CE_INSTALL_DIR)/docs/spi/html/index.html
Scale example. Codec in $(CE_INSTALL_DIR)/examples/.../codecs/scale and VISA extension support in $(CE_INSTALL_DIR)/examples/...extensions/scale
Algorithm Creator
Algorithm Creator
The codec creator is responsible for creating an XDAIS algorithm, and providing the necessary packaging to enable these algorithms to be consumed, and configured by CE.
If the codec is XDM compliant, CE's VISA APIs will support remote execution of the codecs without additional support. However, if the codec is *not* XDM compliant, and the codecs support remote execution, they will need to supply CE skeletons and stubs.
Responsibilities
Generate a codec library with appropriate IALG and optional IDMA3 interface symbols exported
Implement the ti.sdo.ce.ICodec interface, referencing the requisite exported symbols
Inputs
XDAIS, XDCtools
Outputs
A released codec package. This package includes a module that implements ti.sdo.ce.ICodec, as well as the libraries that contain the algorithm's implementation.
Notes
The codec creator is responsible for creating an XDAIS algorithm, and providing the necessary packaging to enable these algorithms to be consumed, and configured by CE.
If the codec is XDM compliant, CE's VISA APIs will support remote execution of the codecs without additional support. However, if the codec is *not* XDM compliant, and the codecs support remote execution, they will need to supply CE skeletons and stubs.
Responsibilities
Generate a codec library with appropriate IALG and optional IDMA3 interface symbols exported
Implement the ti.sdo.ce.ICodec interface, referencing the requisite exported symbols
Inputs
XDAIS, XDCtools
Outputs
A released codec package. This package includes a module that implements ti.sdo.ce.ICodec, as well as the libraries that contain the algorithm's implementation.
Notes
tms320 code engine
The Codec Engine (CE) is a framework which enables several customer use cases, from ARM-side application developers to DSP-side codec authors, and several integrators in between. In many cases, these roles may be played by a single person - in other development environments, a different developer may be assigned each role individually. This topic describes the 4 primary roles which CE users will play, and the inputs and outputs of each role.
Because CE is very portable and configurable, and can run in many different environments, the descriptions of these roles may be intentionally vague. When applicable, specific hardware and software environments are described after the general descriptions.
Because CE is very portable and configurable, and can run in many different environments, the descriptions of these roles may be intentionally vague. When applicable, specific hardware and software environments are described after the general descriptions.
application using DSP Link on OMAPL1x
application using DSP Link on OMAPL1x
For many developers that have extensive background on TI DSPs, going to an ARM+DSP processor platform usually imposes a difficult learning curve due to the complexity of the interactions between a High Level Operating System (HLOS) and the familiar DSP/BIOS - not to mention the different development environment (usually Linux).
In order to help with such big learning curve, this article covers in detail an example application that not only loads and runs the DSP from the ARM (using the PROC mechanism of DSP/Link) but also allows the DSP to access hardware peripherals directly (either via CSL or BSL). It also shows a safe method of sharing memory (POOL) and passing control messages (Message Queue or MSGQ) between the two operating systems - Linux on the ARM and DSP/BIOS on the DSP.
Updated Release 1.10! Based on feedback received, some fixes and improvements were incorporated to the example application, including a Windows command line version. Please check the differences in the file <readme.txt> on the download page and highlighted in the text below.
FIFO Ordering of DMA Transfers and Linked DMA Transfers
FIFO Ordering of DMA Transfers and Linked DMA Transfers
Several outstanding DMA transfer requests may be submitted asynchronously to run concurrently on separate logical DMA channels. Only transfer requests started on the same logical channel are guaranteed to start and complete in a strictly first-in first-out (FIFO) ordering.
In order to start multiple DMA transfers simultaneously but in a strict FIFO order, the IDMA3 interface introduces the notion of logical channels with more than 1 configurable transfer. Each ACPY3_start issued on a logical DMA channel, in effect, issues these as linked DMA transfers, similar to the mechanism provided by the EDMA3.0 hardware. In addition to the enforced FIFO ordering, the ACPY3 library submits linked transfers more efficiently, so their use is encouraged even if FIFO ordering is not strictly required.
ACPY3 additionally allows synchronizing with one or more intermediate transfers within a linked channel. The number of intermediate waits must be indicated in the “numWaits” field when requesting an IDMA3 channel that will be used to wait on intermediate transfers.
DMA Transfer Submission and Synchronization using ACPY3
DMA Transfer Submission and Synchronization using ACPY3
Algorithms or applications can use the physical DMA resources obtained through the IDMA3 interface directly or using any custom DMA library. However, the TI Framework Components package provides a high performance library, ACPY3, which may be used to perform a rich set of DMA operations using the logical DMA channels acquired through the IDMA3 protocol.
The ACPY3 API introduces several DMA transfer-related abstractions highlighted in the following subsections.
Algorithms or applications can use the physical DMA resources obtained through the IDMA3 interface directly or using any custom DMA library. However, the TI Framework Components package provides a high performance library, ACPY3, which may be used to perform a rich set of DMA operations using the logical DMA channels acquired through the IDMA3 protocol.
The ACPY3 API introduces several DMA transfer-related abstractions highlighted in the following subsections.
TMS320 DMA Resource Management using DMAN3
TMS320 DMA Resource Management using DMAN3
The IDMA3 interface does not specify or mandate the use of a particular framework DMA Resource manager. However, the TI Framework Components package provides DMAN3 as a fully-supported and configurable DMA Resource manager in charge of managing the EDMA3.0 physical resources that the application framework has given exclusively to DMAN3.
In a typical Framework Component based application, DMAN3 grants each algorithm the DMA resources it requests via the IDMA3 interface. The algorithm subsequently may call ACPY3 functions to configure logical channel settings, to request DMA transfers, or to synchronize with on-going transfers.
DMAN3 can be configured using a runtime C interface or statically using XDC tooling. The configuration provides DMAN3 with the physical EDMA3 resources: PaRAMs, TCCs, QDMA channels. DMAN3 configuration dictates how it allocates and manages the memory supplied to each logical DMA channel. DMAN3 additionally supports sharing of physical EDMA3 resources among algorithms created with the same scratch groupId whenever it is possible. It is the responsibility of the application framework to ensure that algorithms created using the same DMAN3 scratch groupIds do not pre-empt each other. See the section titled DMAN3 Configuration Examples for some common allocation scenarios and tips.
The IDMA3 interface does not specify or mandate the use of a particular framework DMA Resource manager. However, the TI Framework Components package provides DMAN3 as a fully-supported and configurable DMA Resource manager in charge of managing the EDMA3.0 physical resources that the application framework has given exclusively to DMAN3.
In a typical Framework Component based application, DMAN3 grants each algorithm the DMA resources it requests via the IDMA3 interface. The algorithm subsequently may call ACPY3 functions to configure logical channel settings, to request DMA transfers, or to synchronize with on-going transfers.
DMAN3 can be configured using a runtime C interface or statically using XDC tooling. The configuration provides DMAN3 with the physical EDMA3 resources: PaRAMs, TCCs, QDMA channels. DMAN3 configuration dictates how it allocates and manages the memory supplied to each logical DMA channel. DMAN3 additionally supports sharing of physical EDMA3 resources among algorithms created with the same scratch groupId whenever it is possible. It is the responsibility of the application framework to ensure that algorithms created using the same DMAN3 scratch groupIds do not pre-empt each other. See the section titled DMAN3 Configuration Examples for some common allocation scenarios and tips.
Monday, July 16, 2012
TMS320LF2406 Decryption
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1.High-Performance Static CMOS Technology
33-ns Instruction Cycle Time(30 MHz)
30-MIPS Performance
Low-Power 3.3-V Design
2. Based on TMS320C2XX DSP CPU Core
Code-compatible with F243/F241/C242
Instruction Set and Module Compatible With F240/C240
3. On-Chip Memory
Up to 32K Words x 16 Bits of Flash EEPROM(4 Sectors)
Up to 2.5K Words x 16 Bits of Data/program RAM
1)544 words of Dual-Access RAM
2)Up to 2k words of Single-Access RAM
4. Boot ROM
SCI/SPI Bootloader
5. Two Event-Manager (EV) Modules (EVA and EVB), Each Include:
Two 16-bit general-purpose timers
Eight 16-bit Pulse-width Modulation (PWM)Channels with Enable
1)Three-phase Inverter Control
2)Center or Edge-Alignment of PWM Channels
Monday, June 25, 2012
decryption parts
Z86E03 Z86E04 Z86E06 Z86E07 Z86E08 Z86E11 Z86E122 Z86E123 Z86E124 Z86E125 Z86E126 Z86E132 Z86E133 Z86E134 Z86E135 Z86E136 Z86E142 Z86E143 Z86E144 Z86E145 Z86E146 Z86E18 Z86E21 Z86E23 Z86E30 Z86E31 Z86E33 Z86E34 Z86E40 Z86E43 Z86E44 Z86E61 Z86E63 Z86E73 Z86E74 Z86E83 Z89371 Z86E001 Z8PE00 Z8PE003
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Wednesday, June 6, 2012
PCB copying
PCB copying, which is also called pcb cloning, printed circuit board coping, printed circuit board cloning, PCB reverse,
etc., refers to the process of getting pcb files, schematic circuit
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technology, complete parse and application research of the principle of
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Tuesday, May 29, 2012
For Tech Start-Ups, New York Has Increasing Allure
When Doug Imbruce wanted to start an interactive video company in 2009,
he had no luck finding investors in New York. So he moved to Silicon
Valley — where venture capitalists were receptive to his pitch — and
founded Qwiki.
But in February, he decided that being so far away from the nation’s big
media companies was stifling his start-up’s growth. So he moved back to
New York, bringing the company with him. Qwiki, with 15 employees, now
operates out of a SoHo loft space.
“We went to Silicon Valley because they understood how big we wanted to
get,” Mr. Imbruce said, “and we moved back to fulfill that promise.”
The recent burgeoning of New York’s Internet industry has forced some
entrepreneurs — who, just a few years ago, might have felt they had
little choice but to head west to pursue their dreams — to make a
difficult choice. New York is now enough of an attractive alternative
that a few West Coast-born start-ups are even packing up and moving
east.
Much of this change has to do with the way that the technology industry
has shifted toward creating consumer products and applications, rather
than building the basic framework of computing and the Internet. Many
new start-ups benefit from proximity to the media, advertising and
fashion industries, New York’s strengths. And as the city’s industry
grows, entrepreneurs say, it is offsetting some of the traditional
disadvantages of being outside Silicon Valley.
There is little talk of New York overtaking the Bay Area as the hub of
the country’s technology industry. And the concept of New York as a real
rival to Silicon Valley can make some Californian eyes start rolling.
“You can definitely build great companies elsewhere, but I have not seen
anyplace in the world that builds true global franchises —
technology-based franchises — like this place does,” said John
O’Farrell, a partner at the venture capital firm Andreessen Horowitz,
based in Menlo Park, Calif. Though the firm has invested in several New
York-based start-ups, Mr. Farrell said, it sets the bar higher for them,
largely because it believes they are less likely to succeed.
A lack of venture capital financing outside of Silicon Valley has
traditionally been a prohibitive barrier for start-up founders who might
have wanted to put down roots elsewhere. But that is changing. Almost
500 start-ups in New York received venture financing from 2007 to 2011,
according to a recent report
from the Center for an Urban Future, a New York-based public policy
organization. The number of venture capital deals in the city has risen
32 percent since 2007, while the figures for other areas, including the
Valley, have dropped. And several major venture capital firms have
recently opened offices in New York.
When Mr. Imbruce sought investment for Qwiki in New York in 2009, his
pitch fell flat. He did eventually find a California-based investor who
offered to back the company, but only if Mr. Imbruce moved west and
immersed himself in the Silicon Valley scene. He agreed, and soon found
investors to be much more receptive, to the tune of $10.5 million in
financing.
What eventually drew Mr. Imbruce back to New York was the gravitational
pull of the major media companies. Soon after arriving in New York,
Qwiki began meeting regularly with ABC to discuss how the network could
use Qwiki’s tools. Last week, the two companies announced a partnership.
Such collaborations are New York’s biggest draw. The biggest drawback is
hiring. Silicon Valley has the deepest pool of qualified engineers in
the country, because of Stanford and the major technology companies that
are based there. On the East Coast, many talented engineers gravitate
to finance, which offers salaries that start-ups cannot compete with.
Aaron Harris moved his company, TutorSpree,
from Silicon Valley to New York last year. He said he was so concerned
about finding engineers that he held open the possibility of moving back
to Mountain View, Calif., where he had participated in the prestigious
incubator program at Y Combinator. But Mr. Harris found that he did not
have to rely on hiring New York-based engineers. Instead, he found them
elsewhere and convinced them to move.
The woes of the financial industry have also benefited New York’s tech
start-ups, which have been able to poach some engineering talent. But
Mr. Harris, who worked for a hedge fund before starting TutorSpree, is
skeptical that this will continue once the tech industry goes through
its next downturn.
“We’re seeing résumés from people in finance all the time, and that’s
awesome,” he said. “We’ll see how long that lasts.”
Thursday, May 3, 2012
TI and ADI at PCIM
At the PCIM power electronics and intelligent motion exhibition which opens in Nuremberg, Germany next week (May 8-10) Texas Instruments will be showing a 2.5A stepper motor controller.
Called DRV8818, its has 150mΩ output low-side output devices and 220mΩ on the high-side, which TI claims cuts power waste compared with some alternatives.
The chip is actually a higher-powered version of the existing 1.9-A DRV8811, with which it is pin-compatible.
To reduce audible noise and improve system stability, decay modes and timing parameters are adjustable.
Full, half, quarter and eighth micro stepping is built in, as are multiple fault protections.
The DRV8818EVM evaluation module should also be there, which includes a pre-programmed MSP430 microcontroller, that supports user-controlled acceleration, deceleration and motion profiles.
Diodes, which absorbed Oldham-based Zetex a few years ago, will have a reduced-height power mosfet to talk about.
“We have launched a line of n and p-channel mosfets in DFN2020-6 packages with an off-board height of only 0.4mm, and a footprint of 4mm2,” said the firm.
The DMP2039UFDE4 is a -25V rated p-channel with 3kV protection against electrostatic discharge.
Typical RDS(on) in the -12V DMP1022UFDE is 13mΩ at 4.5V Vgs.
Other mosfets in the series are provided in a 0.5mm high DFN2020E package.
Aimed at load switching and dc-dc converters, the 20V n-channel DMN2013UFDE offers 2kV ESD protection, and then there is the 60V DMN6040UFDE “one of the first high-voltage mosfets to be introduced in the DFN2020 package, and suits industrial and HVAC controls”, said Diodes.
Advanced Power Electronics is touting the first in its family of dc-dc converter output devices with two mosfets in a single 5x6mm package.
Within AP6922GMT-HF-3 is a 30V control mosfet with a maximum on-resistance of 8.5mΩ and continuous drain current rating of 15A (25°C), plus a 30V synchronous rectifier mosfet with a 25.7A drain (25°C) and 3.8mΩ maximum on-resistance.
The same firm has an interesting IGBT especially for camera flashes.
N-channel AP28G40GEO is rated at 400V and a huge 150A, despite being squeezed into TSSOP-8 package.
Renesas will have devices covering voltage range from 20 to 1,500V, including a p-mosfet three-phase bridge for dc motor drives in a LFPAK.
This package replaces internal bond wires with gold bumps to cut package resistance improve heat flow.
It will also be talking about HVSON8, miniHVSON8 and WPAK packages, which use aluminium ribbon and copper clip connections to improve performance. “HSON8 is the latest development combining the performance of a standard TO-252 package with outlines of SOP8”, claimed the firm.
Along with a 600V super junction p-mosfet for PSUs including power factor correction, Renesas will be showing a portfolio of IGBT to support power solutions such as inverters for solar, welding, industrial motor, pumps, UPS, PSU, home appliances and induction heating.
Its ‘thin wafer’ IGBTs cover 600-1,350V and 5-50A (100°C) in DPak, D2Pak, TO220, TO247, and TO-3P.
To partner IGBTs, the firm is highlighting opto-couplers at PCIM.
For higher temperature, Renesas has the PS9307 series which comes in a 6pin SDIP and will work up to 125°C, 600mA out, and 50kV/µs common mode minimum.
At the high-speed industrial end will be two 10Mbit/s opto-couplers (PS9123 and PS9324) that feature 110°C and 3.3V operation.
For cramped boards, PS9123 has a totem pole output from a 5pin SOP, then PS9324 is open-collector and in a 6pin SDIP for 5kVrms isolation and 8mm creepage
Lastly there will be an extra-long package for a minimum creepage distance of 14mm from Renesas.
The first isolators in the ‘Long-SDIP’ will be a 2.5A output IGBT drive, and a 10Mbps high speed.
Toshiba is also revealing super-junction silicon mosfets.
This time the products are aimed at AC adaptors and lighting ballasts.
And Toshiba will be unveiling a series of single-chip inverter intelligent power devices “that minimise component count and improve efficiency in inverter drives for brushless DC motors,” claimed the firm.
Plus it will have an expanded range of low-voltage mosfets.
Although it will not say what yet, ON Semiconductor is known to be introducing new power modules and discrete IGBTs at PCIM, for applications such as home appliances, automotive, industrial, lighting, and portable consumer.
For electric vehicles, International Rectifier will be describing its COOLiR silicon process and COOLiR2 packaging technology.
“It helps to reduce the size, weight and system cost of electric power train components”, is all the firm will say so far.
Current transducer firm LEM will have its ITZ ultra-precision series at PCIM.
Working from 600A to 24kA, the sensors are intended for AC, DC and pulsed currents.
“Achieving extreme accuracy at very high current levels is a challenging problem in measurement technology,” said LEM. “We used closed-loop flux-gate technology to address the problem. This provides initial offset error of under 2ppm, linearity in the range of 1-10ppm, and extremely low thermal drift of 0.1-0.6 ppm/K.”
Consisting of a transducer head (0-55°C) plus signal-conditioning 19in. rack (10-40°C), the units are mains powered.
Current or voltage output is available, plus other outputs indicating the transducer state: operational/not operational; current extremely low; current extremely high; or transducer overloaded. Built-in LEDs mirror the output states.
600 and 2,000A models are available as programmable units with either current or voltage outputs (40 to 620A in steps of 20A, or 125 to 2,000A in 125A steps.
Bandwidth, according to model, is 2-500kHz (+/-3 dB) and overload for the largest model is 30kA for 100ms. Transducer apertures range from 25 to 150mm diameter.
On top of this, LEM is presenting a new series of open-loop asic-based transducers “specifically designed to meet the technology advances in drives and inverters which require better performance in areas such as thermal drifts, response time, power supply and noise”.
Vicor will be showing-off its 850W 80A quarter brick intermediate bus converter with 98% peak efficiency.
Part of the IBC050 product line, it is intended to be a drop-in upgrade for industry standard 5:1 fixed ratio converters.
Called IB050Q096T80N1-00, it operates from a 36 to 60V input voltage range and offers 2.25kV isolation.
Full rating is available from 55 to 60V (50°C 400LFM airflow), dropping to 550W at 36V.
Size is 58x37x10.5mm.
Inside, the firm’s ‘sine amplitude converter’ topology operating at 1MHz “cuts transient response time by a factor of 10 and eliminates the need for bulk capacitors across the intermediate bus,” claims the firm.
Vicor’s engineering director Maurizio Salato will present a paper on power factor correction at the conference that runs alongside the exhibition at PCIM.
Also amongst the many papers will be one by Analog Devices’ application engineer Dr Bernhard Strzalkowski describing an adaptive dead time control method for forward converters.
Live demonstrations are everywhere at PCIM, and ADI’s stand is no exception.
Its demos will include industrial communication modules working with isolated transceivers and its Blackfin ADSP-BF506F DSP to coordinate multiple motor drives using wired communications such as EtherCAT and Ethernet/IP, and CAN and Profibus fieldbus protocols.
Featuring touch screen control of a robotic arm through an isolated Controller Area Network (CAN) that simplifies operation and improves accuracy. The robot arm controller board contains the ADM3053 signal and power isolated CAN transceiver and is used with the ADuC7128 microcontroller to receive CAN messages from the Blackfin ADSP-BF548-ezkit.
Demonstration of a complete ac motor drive development platform that simplifies the deployment of customised control algorithms, along with standard function such as Field Oriented Control using high level graphical interface tools.
It shows the integration of ADI processor code development tools and Boston Engineering ac motor control development hardware with MATLAB and Simulink algorithm development and code generation products from MathWorks. The ac motor signal chain elements include input PFC control, gate drive signal isolation, current, and voltage and position feedback and a Blackfin motor control IC.
FROM:electronicsweekly.com
Called DRV8818, its has 150mΩ output low-side output devices and 220mΩ on the high-side, which TI claims cuts power waste compared with some alternatives.
The chip is actually a higher-powered version of the existing 1.9-A DRV8811, with which it is pin-compatible.
To reduce audible noise and improve system stability, decay modes and timing parameters are adjustable.
Full, half, quarter and eighth micro stepping is built in, as are multiple fault protections.
The DRV8818EVM evaluation module should also be there, which includes a pre-programmed MSP430 microcontroller, that supports user-controlled acceleration, deceleration and motion profiles.
“We have launched a line of n and p-channel mosfets in DFN2020-6 packages with an off-board height of only 0.4mm, and a footprint of 4mm2,” said the firm.
The DMP2039UFDE4 is a -25V rated p-channel with 3kV protection against electrostatic discharge.
Typical RDS(on) in the -12V DMP1022UFDE is 13mΩ at 4.5V Vgs.
Other mosfets in the series are provided in a 0.5mm high DFN2020E package.
Aimed at load switching and dc-dc converters, the 20V n-channel DMN2013UFDE offers 2kV ESD protection, and then there is the 60V DMN6040UFDE “one of the first high-voltage mosfets to be introduced in the DFN2020 package, and suits industrial and HVAC controls”, said Diodes.
Within AP6922GMT-HF-3 is a 30V control mosfet with a maximum on-resistance of 8.5mΩ and continuous drain current rating of 15A (25°C), plus a 30V synchronous rectifier mosfet with a 25.7A drain (25°C) and 3.8mΩ maximum on-resistance.
The same firm has an interesting IGBT especially for camera flashes.
N-channel AP28G40GEO is rated at 400V and a huge 150A, despite being squeezed into TSSOP-8 package.
Renesas will have devices covering voltage range from 20 to 1,500V, including a p-mosfet three-phase bridge for dc motor drives in a LFPAK.
This package replaces internal bond wires with gold bumps to cut package resistance improve heat flow.
It will also be talking about HVSON8, miniHVSON8 and WPAK packages, which use aluminium ribbon and copper clip connections to improve performance. “HSON8 is the latest development combining the performance of a standard TO-252 package with outlines of SOP8”, claimed the firm.
Along with a 600V super junction p-mosfet for PSUs including power factor correction, Renesas will be showing a portfolio of IGBT to support power solutions such as inverters for solar, welding, industrial motor, pumps, UPS, PSU, home appliances and induction heating.
Its ‘thin wafer’ IGBTs cover 600-1,350V and 5-50A (100°C) in DPak, D2Pak, TO220, TO247, and TO-3P.
To partner IGBTs, the firm is highlighting opto-couplers at PCIM.
For higher temperature, Renesas has the PS9307 series which comes in a 6pin SDIP and will work up to 125°C, 600mA out, and 50kV/µs common mode minimum.
At the high-speed industrial end will be two 10Mbit/s opto-couplers (PS9123 and PS9324) that feature 110°C and 3.3V operation.
For cramped boards, PS9123 has a totem pole output from a 5pin SOP, then PS9324 is open-collector and in a 6pin SDIP for 5kVrms isolation and 8mm creepage
Lastly there will be an extra-long package for a minimum creepage distance of 14mm from Renesas.
The first isolators in the ‘Long-SDIP’ will be a 2.5A output IGBT drive, and a 10Mbps high speed.
Toshiba is also revealing super-junction silicon mosfets.
This time the products are aimed at AC adaptors and lighting ballasts.
And Toshiba will be unveiling a series of single-chip inverter intelligent power devices “that minimise component count and improve efficiency in inverter drives for brushless DC motors,” claimed the firm.
Plus it will have an expanded range of low-voltage mosfets.
Although it will not say what yet, ON Semiconductor is known to be introducing new power modules and discrete IGBTs at PCIM, for applications such as home appliances, automotive, industrial, lighting, and portable consumer.
For electric vehicles, International Rectifier will be describing its COOLiR silicon process and COOLiR2 packaging technology.
“It helps to reduce the size, weight and system cost of electric power train components”, is all the firm will say so far.
Current transducer firm LEM will have its ITZ ultra-precision series at PCIM.
Working from 600A to 24kA, the sensors are intended for AC, DC and pulsed currents.
“Achieving extreme accuracy at very high current levels is a challenging problem in measurement technology,” said LEM. “We used closed-loop flux-gate technology to address the problem. This provides initial offset error of under 2ppm, linearity in the range of 1-10ppm, and extremely low thermal drift of 0.1-0.6 ppm/K.”
Consisting of a transducer head (0-55°C) plus signal-conditioning 19in. rack (10-40°C), the units are mains powered.
Current or voltage output is available, plus other outputs indicating the transducer state: operational/not operational; current extremely low; current extremely high; or transducer overloaded. Built-in LEDs mirror the output states.
600 and 2,000A models are available as programmable units with either current or voltage outputs (40 to 620A in steps of 20A, or 125 to 2,000A in 125A steps.
Bandwidth, according to model, is 2-500kHz (+/-3 dB) and overload for the largest model is 30kA for 100ms. Transducer apertures range from 25 to 150mm diameter.
On top of this, LEM is presenting a new series of open-loop asic-based transducers “specifically designed to meet the technology advances in drives and inverters which require better performance in areas such as thermal drifts, response time, power supply and noise”.
Vicor will be showing-off its 850W 80A quarter brick intermediate bus converter with 98% peak efficiency.
Part of the IBC050 product line, it is intended to be a drop-in upgrade for industry standard 5:1 fixed ratio converters.
Called IB050Q096T80N1-00, it operates from a 36 to 60V input voltage range and offers 2.25kV isolation.
Full rating is available from 55 to 60V (50°C 400LFM airflow), dropping to 550W at 36V.
Size is 58x37x10.5mm.
Inside, the firm’s ‘sine amplitude converter’ topology operating at 1MHz “cuts transient response time by a factor of 10 and eliminates the need for bulk capacitors across the intermediate bus,” claims the firm.
Vicor’s engineering director Maurizio Salato will present a paper on power factor correction at the conference that runs alongside the exhibition at PCIM.
Also amongst the many papers will be one by Analog Devices’ application engineer Dr Bernhard Strzalkowski describing an adaptive dead time control method for forward converters.
Live demonstrations are everywhere at PCIM, and ADI’s stand is no exception.
Its demos will include industrial communication modules working with isolated transceivers and its Blackfin ADSP-BF506F DSP to coordinate multiple motor drives using wired communications such as EtherCAT and Ethernet/IP, and CAN and Profibus fieldbus protocols.
Featuring touch screen control of a robotic arm through an isolated Controller Area Network (CAN) that simplifies operation and improves accuracy. The robot arm controller board contains the ADM3053 signal and power isolated CAN transceiver and is used with the ADuC7128 microcontroller to receive CAN messages from the Blackfin ADSP-BF548-ezkit.
Demonstration of a complete ac motor drive development platform that simplifies the deployment of customised control algorithms, along with standard function such as Field Oriented Control using high level graphical interface tools.
It shows the integration of ADI processor code development tools and Boston Engineering ac motor control development hardware with MATLAB and Simulink algorithm development and code generation products from MathWorks. The ac motor signal chain elements include input PFC control, gate drive signal isolation, current, and voltage and position feedback and a Blackfin motor control IC.
FROM:electronicsweekly.com
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